Analysis of die tilt effect on silicon die crack propagation in a small outline transistor using computational fracture mechanics
In today's microelectronic industry, the increasing demand for miniaturization and high functions integration poses a big challenge in maintaining the reliability of the package. Several studies were conducted to address these challenges. It was found out that majority of the reliability proble...
| Main Author: | |
|---|---|
| Other Authors: | , |
| Format: | Thesis |
| Language: | English |
| Subjects: |