Low thermal expansion alloys and composites proceedings of a symposium co-sponsored by The Refectory Metals Committee of the Structural MaterialsDivision (SMD) and the Electronic Packaging and Interconnection Materials Committee of the Electronic Magnetic and Photonics Materials Division (EMPMD), held at the Fall Meeting of the Minerals, Metals and Materials Society in Chicago, Illinois, November 2-5, 1992

Bibliographic Details
Corporate Author: Minerals, Metals and Materials Society Meeting ( 1992 : Chicago, Ill.)
Format: Book
Language:English
Published: Warrendale, Pa. Minerals, Metals and Materials Society c1994.
Subjects: