Manufacturing processes and materials challenges in microelectronic packaging presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991

Manufacturing processes and materials challenges in microelectronic packaging presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991

Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Applied Mechanics Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Winter Meeting (1991 : Atlanta, Ga.)
Format: Book
Language:English
Published: New York The Society 1991.
Subjects:
Electronic packaging > Congresses.
Microelectronic packaging > Congresses.