Phenomenological study of thermal aging effects on intermetallic growth mechanisms and shear strength behavior of wafer level solder bumps
The effect of wafer level solder bump size on solder bump strength and intermetallic growth as a function of time, at different storage temperatures is studies, using solder bumps of two different heights :95 um (SB95) and 142 um (SB142). Smaller solder bumps (SB95) lead to a faster decrease in bump...
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| Format: | Thesis |
| Language: | English |
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2007.
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