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Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method
Published 2018Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
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Virtual manufacturing
Published 2011Available for the University of the Philippines Diliman via SpringerLink. Click here to access
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