Ultra-thin chip technology and applications

Available for the University of the Philippines Diliman via SpringerLink. Click here to access

Manufacturing yield evaluation of VLSI/WSI systems

Handbook of quality integrated circuit manufacturing by Zorich, Robert

Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy

Phenomenological study of thermal aging effects on intermetallic growth mechanisms and shear strength behavior of wafer level solder bumps by Amistoso, Jose Omar S.