Polymeric materials for electronics packaging and interconnection
Other Authors: | , |
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Format: | Electronic Resource |
Language: | English |
Published: |
Washington, DC
American Chemical Society
[1989]
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Subjects: | |
Online Access: | Available for University of the Philippines Diliman via ACS Publications. Click here to access Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy |