Reliability of RoHS-Compliant 2D and 3D IC interconnects

Bibliographic Details
Main Author:	Lau, John H.
Format:	Electronic Resource
Language:	English
Published:	New York, N.Y. McGraw-Hill c2011.
Edition:	First edition.
Subjects:	Interconnects (Integrated circuit technology) > Reliability. Green technology > Reliability. Electronic books.
Online Access:	Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy