Handbook of multilevel metallization for integrated circuits materials, technology, and applications

Handbook of multilevel metallization for integrated circuits materials, technology, and applications

Bibliographic Details
Other Authors: Wilson, Syd R., Tracy, Clarence J., Freeman, John L.
Format: Book
Language:English
Published: Park Ridge, N.J. Noyes c1993.
Subjects:
Integrated circuits > Design and construction.
Metallizing.