Thermal design of liquid cooled microelectronic equipment thermal solutions, analysis methods, and design practices

Bibliographic Details
Main Author:	Yeh, L.T (Author)
Format:	Electronic Resource
Language:	English
Published:	New York, N.Y. The American Society of Mechanical Engineers [2019]
Subjects:	Electronic apparatus and appliances > Cooling. Electronic books. Electronic apparatus and appliances > Thermal properties. Microelectronics > Equipment and supplies. Cold plates (Electronics).
Online Access:	Click here to access thru EZproxy Click here to access