Showing 1 - 10 results of 16 for search 'Lau, John H.', query time: 0.02s Refine Results
  1. 1

    Assembly and reliability of lead-free solder joints by Lau, John H., Lee, Ning-Cheng

    Published 2020
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Assembly and reliability of lead-free solder joints
  2. 2

    Heterogeneous integrations by Lau, John H.

    Published 2019
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Heterogeneous integrations
  3. 3

    Fan-out wafer-level packaging by Lau, John H.

    Published 2018
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Fan-out wafer-level packaging
  4. 4

    3D IC integration and packaging by Lau, John H.

    Published 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  5. 5

    Through-silicon vias for 3D integration by Lau, John H.

    Published 2013
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Through-silicon vias for 3D integration
  6. 6

    Reliability of RoHS-Compliant 2D and 3D IC interconnects by Lau, John H.

    Published 2011
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Reliability of RoHS-Compliant 2D and 3D IC interconnects
  7. 7

    Advanced MEMS packaging

    Published 2010
    Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Book

    Advanced MEMS packaging
  8. 8

    Advanced MEMS packaging

    Published 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Advanced MEMS packaging
  9. 9

    Electronics manufacturing with lead-free, halogen-free, and conductive-adhesive materials

    Published 2003
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Electronics manufacturing with lead-free, halogen-free, and conductive-adhesive materials
  10. 10

    Microvias for low-cost, high density interconnects by Lau, John H.

    Published 2001
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Microvias for low-cost, high density interconnects

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